Self-adaption soft sensor array design for sEMG control
发布时间:2020-12-13 点击次数:
第一作者:Naishi Feng
通讯作者:Hong Wang
合写作者:Yuqi Xin, Jiale Gong, Fo Hu
发表刊物:IEEE Sensors Journal
期号:6
卷号:21
影响因子:3.301
DOI码:10.1109/JSEN.2020.3047383
所属单位:School of Mechanical Engineering and Automation, Northeastern University, Shenyang 110824, China
关键字:Array electrode; Artifact signal; Correlation coefficient; MUAP duration; Soft material
页面范围:8367-8374
ISSN号:1530-437X
是否译文:否
