Microstructure characterization and fracture behaviors of Silicon carbide/ metallic glass composites with interpenetrating architecture
- 第一作者:张慧铭
- 通讯作者:李宏
- 论文名称:Microstructure characterization and fracture behaviors of Silicon carbide/ metallic glass composites with interpenetrating architecture
- 发表刊物:Intermetallics
- 卷号:165
- 论文类型:SCI JCR Q1
- 页面范围:108168
- 是否译文:否