Title:一种基于光纤错位熔接结构和Sagnac环的温度和折射率双参数传感装置
Patent Applicant:雷铭(S),张勇(S),杨时月(S),胡海峰
Note:专利证书编号:CN 108279039 A
Service Invention or Not:No
Application Date:2018-01-08
Publication Date:2018-07-13
First Author:Zhao Yong
Title:一种基于光纤错位熔接结构和Sagnac环的温度和折射率双参数传感装置
Patent Applicant:雷铭(S),张勇(S),杨时月(S),胡海峰
Note:专利证书编号:CN 108279039 A
Service Invention or Not:No
Application Date:2018-01-08
Publication Date:2018-07-13
First Author:Zhao Yong