Title:一种基于无芯光纤径向大错位结构涂覆聚二甲基硅氧烷的点式温度传感装置
Patent Applicant:张勇(S),胡海峰,雷铭(S),杨时月(S)
Note:专利证书编号:ZL201810039992.7
Service Invention or Not:No
Application Date:2018-01-08
Publication Date:2020-11-24
Authorization Date:2020-11-24
First Author:Zhao Yong
Patents
一种基于无芯光纤径向大错位结构涂覆聚二甲基硅氧烷的点式温度传感装置
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