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历秀明
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Associate professor
- Name (Pinyin):LI Xiuming
- Date of Birth:1985-07-25
- E-Mail:983d9cdb94becdd160a5c30352efb96fc55f0cd8b7e6bac31a435c43e1b301679c27f24dd382cdf9fb38a770217ceb9cdce3f48608012e2168b0371ff1ef5b0a6e5793249003f2ceafea66a0444bc1c6b39994f1d3e07b73cd2aa9540ff182000ba019369fc98688b7662900be207f363139718c57086de89e27dcddec77a1d3
- Date of Employment:2020-04-09
- Administrative Position:副所长
- Business Address:知行楼602
- Gender:Male
- Degree:博士
- Status:Employed
- Alma Mater:大连理工大学
- 2025-08elected:Energy and Built Environment国际期刊学术新人奖“优秀青年学者”提名奖
- 2024-08elected:2024第17届大学生节能减排社会实践与科技竞赛二等奖（指导教师）
- 2024-09elected:2024美的杯第七届中国制冷空调创新竞赛二等奖（指导教师）
- 2024-07elected:2024海尔智慧楼宇第十八届中国制冷空调行业大学生科技竞赛一等奖（指导教师）
- 2023-11elected:2023首届全国暖通空调智能化学术年会一等奖
- 2023-03elected:2022获中文核心期刊《制冷学报》优秀论文
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[ 1 ],Xiuming Li,Haoxue Liu,Siqi Liu,Haiyang Zhang,Zongwei Han#,Bo Gao#,Lun Zhang#,Wei Ye#.Building environment control for advanced precision instruments - state-of-the-art and future perspectives.Clean Energy Science and Technology.10.18686/cest460,
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[ 2 ],Sen Guo,Xiuming Li#,Chao Shen#,Zongwei Han.Advances in thermal management of semiconductor devices: multi-scenario compatible solutions, challenges, and future perspectives.Applied Thermal Engineering.10.1016/j.applthermaleng.2025.128010,
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[ 3 ],Haoxue Liu*,Xiuming Li*,Siqi Liu,Haiyang Zhang,Zongwei Han#,Bo Gao#.Simulation study on suppressing temperature fluctuation based on PCM for radiant supply cooling systems in thermodynamic measurement laboratory.Building Simulation.10.1007/s12273-025-1311-1,
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[ 4 ],Chengxuan Wei,Xiuming Li#,Mengyi Li,Zongwei Han,Shuangquan Shao,Bo Zhou.A comparative performance study of terminal control strategy for the multi-split backplane cooling system in data centers.International Journal of Refrigeration.10.1016/j.ijrefrig.2024.10.018,
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[ 5 ],王宇枭,成泽帅,江可扬,魏琳扬#,历秀明#.基于辐射制冷与电致变色的可调节多层膜性能研究.物理学报.10.7498/aps.73.20240863,
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[ 6 ],Haoxue Liu,Siqi Liu,Xiuming Li#,Zongwei Han#,Haiyang Zhang,Bo Gao#.Simulation analysis for controlling temperature stability of a radiant-board system served for thermodynamic temperature measurement laboratory.Building Simulation,28.10.1007/s12273-024-1151-4,
