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发布时间:2023-01-09 点击次数:
上一条:Sun C, Lu Y, Xiu S, et al. Analysis on the removal mechanism of disc grinding based on dynamic thermal–mechanical coupling [J]. International Journal of Mechanics and Materials in Design. 2021. (JCR 1区)
下一条:Sun C, Duan J, Lan D, et al. Prediction about ground hardening layers distribution on grinding chatter by contact stiffness [J]. Archives of Civil and Mechanical Engineering. 2018, 18(4), 1626-1642. (JCR 1区)