孙聪（副教授）
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- 博士生导师 硕士生导师
- 电子邮箱：
- 职务：副教授
- 学历：博士研究生毕业
- 性别：男
- 联系方式：024-83689002
- 学位：博士
- 在职信息：在职
- 毕业院校：东北大学
- 所属院系：机械工程与自动化学院
- 学科：机械设计及理论
- 曾获荣誉：
2023-01曾获荣誉当选：辽宁省第五届研究生材料先进连接技术论坛一等奖；
2023-01曾获荣誉当选：EI杂志《表面技术》优秀作者；
2022-11曾获荣誉当选：沈阳市自然学术成果二等奖；
2022-02曾获荣誉当选：机械学院个人贡献奖；
2021-12曾获荣誉当选：东北大学优秀博士论文；
2021-12曾获荣誉当选：东北大学优秀博士后；
2018-10曾获荣誉当选：博士研究生国家奖学金
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- Sun C, Xiu S, Zhang P, et al. Influence of the dynamic disc grinding wheel displacement on surface generation [J]. Journal of Manufacturing Processes. 2022. (JCR 1区).
- Sun C, Hong Y, Xiu S, et al. Complicated microstructure transformation mechanism of the greenly grinding coating layer [J]. Journal of Materials Research and Technology. 2022. (JCR 1区).
- Sun C, Lu Y, Xiu S, et al. Analysis on the removal mechanism of disc grinding based on dynamic thermal–mechanical coupling [J]. International Journal of Mechanics and Materials in Design. 2021. (JCR 1区).
- Sun C, Hong Y, Xiu, S, et al. Grain refinement mechanism of metamorphic layers by abrasive grinding hardening [J]. Journal of Manufacturing Processes. 2021, 69, 125-141. (JCR 1区).
- Sun C, Xiu S, Li Q, et al. Research on the embossment phenomenon of disc grinding by workpiece's removal rate [J]. Archives of Civil and Mechanical Engineering. 2019, 19(3), 739-755. (JCR 1区).
- Sun C, Duan J, Lan D, et al. Prediction about ground hardening layers distribution on grinding chatter by contact stiffness [J]. Archives of Civil and Mechanical Engineering. 2018, 18(4), 1626-1642. (JCR 1区).
- Sun C, Xiu S, Hong Y, et al. Prediction on residual stress with mechanical-thermal and transformation coupled in DGH [J]. International Journal of Mechanical Sciences. 2020, 179, 105629. (JCR 1区).
- Yao Y, Xiu S, Sun C*, et al. Investigation on grinding-induced dynamic recrystallization behavior of 40Cr alloy steel [J]. Journal of Alloys and Compounds. 2021, 867, 158773. (JCR 1区).
- Hong Y, Xiu S, Sun C*, et al. Metallographic method for temperature measurement: Reconstruction of grinding temperature field based on critical austenitizing depth and cyclic feedback algorithm [J]. Journal of Materials Processing Technology. 2022. (JCR 1区).
- Sun C, Deng Y, Lan D, et al. Modeling and predicting ground surface topography on grinding chatter. Procedia CIRP. 2018, 71, 364-369. (EI+Top会议).
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