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Pre One:中国专利, 于瑞云; 郭冰洋; 基于多模态大模型的芯片陶瓷封装基板表面缺陷检测方法, 2025.03.14, 授权, ZL202411729956.5
Next One:中国专利, 于瑞云, 刘斌; 一种芯片高多层陶瓷封装基板产线多约束自动化排程方法, 2024.03.22, 授权, ZL202311684093.X.