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Ruiyun Yu

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B. Guo , Q. Zuo, R. Yu. Point Cloud Segmentation of Integrated Circuits Package Substrates Surface Defects Using Causal Inference: Dataset Construction and Methodology. AAAI Conference on Artificial Intelligence. 2026. (CCF A)

Release Time:2026-03-06| Hits:

Title of Paper:B. Guo , Q. Zuo, R. Yu. Point Cloud Segmentation of Integrated Circuits Package Substrates Surface Defects Using Causal Inference: Dataset Construction and Methodology. AAAI Conference on Artificial Intelligence. 2026. (CCF A)

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Next One:R. Yu, Z. Zhao and S. Zhen. Auxiliary Information Flow for 3D Industrial Defect Detection on IC Ceramic Package Substrate Surfaces: Dataset and Benchmark. IEEE Transactions on Circuits and Systems for Video Technology, 2026. (中科院1区TOP)