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- Profiling Interfacial Reaction Features between Diamond and Cu-Sn-Ti Active Filler Metal Brazed at 1223 K.Journal of Materials Science & Technology,131.[JCR 一区].100-105
- Growth Kinetics of Interfacial Reaction Layer Products between Cubic Boron Nitride and Cu-Sn-Ti Active Filler Metal.Journal of Materials Science & Technology,92.[JCR 一区].69-74
- Determination of optimal holding time for brazing Cu-Sn-Ti/ diamond composites.Diamond and Related Materials,141.[JCR 二区].110706
- Detailing Interfacial Reaction Layer Products between Cubic Boron Nitride and Cu-Sn-Ti Active Filler Metal.Journal of Materials Science & Technology,68.[JCR 一区].35-39
- Influence of Brazing Temperature on Interfacial Reaction Layer Characteristics of Cu-Sn-Ti/diamond Composites.Diamond and Related Materials,128.[JCR 二区].109276
- Brazing Temperature-dependent Interfacial reaction layer features between CBN and Cu-Sn-Ti active filler metal.Journal of Materials Science and Technology,35(10):.[JCR 一区].2163-2168
- Influence of Holding Time on Interfacial Reaction Layer Characteristics and Wear Properties of CBN/Cu-Sn-Ti Composites.Metallurgical and Materials Transactions B,51(3):.[JCR 二区].880-884
- Formation of typical Cu-Ti intermetallic phases via a liquid-solid reaction approach.Intermetallics,113.[JCR 一区].106577
- Optimizing Wear Resistance via Brazing Temperature Adaption: Application into CBN/Cu-Sn-Ti Composites.Metallurgical and Materials Transactions B,50(6):.[JCR 二区].2517-2522.
- Achieving optimal Ti content via interfacial reaction layer characteristics of diamond/Cu-Sn-Ti composites.Ceramics International,50(13):.[JCR 一区].24894-24900