Project Name:工信部产业基础再造与制造业高质量发展专项，超低热膨胀系数(CTE)高导热芯片封装基板-生产工艺稳定性控制系统，2022-07至2025-06

Leading Scientist:于瑞云

Status:在研

Type of Project:工信部产业基础再造和制造业高质量发展专项

Date of Project Approval:2022-07-01

Subsidy Amount(Ten thousand):646.64