Project Name:横向课题，毫米波陶瓷器件封装智能生产线系统集成关键核心技术攻关及产业化示范，2021-09至2024-09

Leading Scientist:于瑞云

Status:在研

Type of Project:太原市科技计划

Date of Project Approval:2021-09-30

Subsidy Amount(Ten thousand):80.0