MEMS晶圆级封装的高粘度光刻胶直接雾化与共形涂膜机理研究

Release Time:2026-09-06| Hits:

Project Name:MEMS晶圆级封装的高粘度光刻胶直接雾化与共形涂膜机理研究

Project Source:国家自然科学基金项目(面上)

Project Level:面上项目

Project Number:62674040

Date of Project Approval:2026-09-01

Scheduled Completion Time:2030-12-31

Date of Project Completion:2030-12-31