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The microparticles adhesion and removal dynamics in wafer-scale physical cleaning process

Release Time:2025-03-28| Hits:

First Author:张磊

Title of Paper:The microparticles adhesion and removal dynamics in wafer-scale physical cleaning process

Journal:Physics of Fluids

Issue:2

Volume:2025,37

Page Number:023318

Translation or Not:No

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Photoresist Spray Coating on Silicon Wafers With Acoustic Resonate Atomization
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