3. Hongtai Cheng; Heping Chen; Ben Mooring., "Accuracy Analysis of Dynamic-Wafer-Handling Robotic System in Semiconductor Manufacturing," Industrial Electronics, IEEE Transactions on , 61(3), 1402-1410, March 2014 doi: 10.1109/TIE.2013.2261034 (IF=5.16)
Release time:2023-08-15 Hits:
Pre One:4. Heping Chen, Hongtai Cheng, Ben Moorings, Harold Stern. Eccentricity estimation with error modeling in dynamic wafer handling. The International Journal of Advanced Manufacturing Technology, 68(1-4), 425-233, March 2013 doi: 10.1007/s00170-013-4740-4 (IF=1.103, 000323105600035)
Next One:2019年，Zhao Yong*, Tong Rui-Jie, Chen Mao-qing, Xia Feng. Relative humidity sensor based on hollow core fiber filled with GQDs-PVA. SENSORS AND ACTUATORS B-CHEMICAL, 2019,284:96-102. IF=7.46(2020), JCR1区.
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