3. Hongtai Cheng; Heping Chen; Ben Mooring., "Accuracy Analysis of Dynamic-Wafer-Handling Robotic System in Semiconductor Manufacturing," Industrial Electronics, IEEE Transactions on , 61(3), 1402-1410, March 2014 doi: 10.1109/TIE.2013.2261034 (IF=5.16)
Release time:2023-08-15 Hits:
Pre One:4. Heping Chen, Hongtai Cheng, Ben Moorings, Harold Stern. Eccentricity estimation with error modeling in dynamic wafer handling. The International Journal of Advanced Manufacturing Technology, 68(1-4), 425-233, March 2013 doi: 10.1007/s00170-013-4740-4 (IF=1.103, 000323105600035)
Next One:2. Hongtai Cheng, Heping Chen, Yong Liu, Topological indoor Localization and Navigation for Autonomous Mobile Robot, IEEE Transactions on Automation Science and Engineering, (Accepted, IF=1.674)
Paper Publications
