董艳伍
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上一条:Hou Zhiwen, Dong Yanwu, Jiang Zhouhua, Liu Limeng, Du Shuyang and Hu Zhihao. Effect of Current-Carrying Mold Current on Multi-physics Fields and Interface Bonding Quality of Compound Rolls[J]. Metallurgical and Materials Transactions B-Process Metallurgy and Materials Processing Science, 2021, 52(5): 3332-3345.
下一条:Cao Yulong, Li Jiawei, Li Guangqiang, Dong Yanwu and Jiang Zhouhua. Effect of Conductive Circuits on Bonding Quality of Bimetallic Composite Roll Produced by Electroslag Remelting Cladding[J]. JOM, 2021, 73(10): 2973-2984.