张磊
开通时间:..
最后更新时间:..
扫描访问手机版
点击次数:
通讯作者:Zhang Lei
发表刊物:Lab on a Chip
期号:9
卷号:2024, 24
页面范围:2418-2427
是否译文:否
上一条:Multi-layer Uniform Photoresist Coating on Silicon Wafers via Spin-Coupled Inkjet Printing
下一条:Acoustic-streaming driven liquid filling patterns inside through-glass vias