张磊
Professor
Scientific Research
Research Field
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Paper Publications
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Zhang Lei,The microparticles adhesion and removal dynamics in wafer-scale physical cleaning process.Physics of Fluids,2025,37(2):023318
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Zhang Lei*Photoresist Spray Coating on Silicon Wafers With Acoustic Resonate Atomization.IEEE Transactions on Semiconductor Manufacturing,2024,37(4):576-582
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Zhang Lei,Multi-layer Uniform Photoresist Coating on Silicon Wafers via Spin-Coupled Inkjet Printing.IEEE Transactions on Components, Packaging and Manufacturing Technology,2025,15(4):821-829.
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Zhang Lei*Acoustic modulation and non-contact atomization of droplets based on the Fabry–Pérot resonator.Lab on a Chip,2024, 24(9):2418-2427
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Zhang Lei*Acoustic-streaming driven liquid filling patterns inside through-glass vias.Physics of Fluids,2024, 36(7):073301
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Zhang Lei*Longitudinal transducer based membrane resonant ejector for high-viscosity and high-frequency micro-droplet jetting.Sensors and Actuators A: Physical,2024, 374,115480
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Zhang Lei*Inkjet Printing Photoresist with Ultralow Viscosity on Silicon Wafers for Uniform Coating.Langmuir,2024, 40(21):11125-11133
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Zhang Lei,Mesoscopic modeling of silver particles melting process on silicon wafer in inkjet-printed solar cell metallization.Computers and Mathematics with Applications,2024, 156:56-63.
Patents
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Published Books
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Research Projects
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激光开膜的晶硅太阳电池栅极喷墨打印成形与Ag/Si接触机理研究，National Natural Science Foundation of China (NSFC)
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G8.5及以上OLED喷墨打印装备开发及产业化，广东省新型显示璀璨行动重大专项
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集成电路先进制程用高产能物理清洗机研制，辽宁省集成电路创新联合体重大专项
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MEMS晶圆的光刻胶精细雾化与涂胶显影制程，辽宁省应用基础研究计划
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晶圆搬运机械手智能化系统开发与验证，技术转化
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8/12英寸晶圆喷印涂胶工艺研发，技术转化
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高精度喷墨图形优化算法与多墨路研制，技术转化
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晶圆级封装的高精度光刻胶雾化技术研究，中央高校基本科研业务费（战略新兴培育）